粉體行業在線展覽
粉體行業在線展覽
SiC籽晶粘接設備
直接聯系
山東力冠微電子裝備有限公司
山東
面議
山東力冠
SiC籽晶粘接設備
259
產品概述/Product Introduction：
? 籽晶的粘接工藝技術是將SiC籽晶通過有機膠粘接在石墨紙上。提高籽晶粘接質量是保證高品質SiC晶體生長的首要前提。
The bonding technology of seed crystal is to bond SiC seed crystal to graphite paper through organic adhesive. Improving the bonding quality of seed crystal is the first prerequisite to ensure the growth of high-quality SiC crystal. .
技術指標/Technical Indicators：
晶圓尺寸: 6-8英寸 Wafer size: 6-8 inches | 溫度350-1000°C,溫度均勻性土3°C Temperature 350 1000°C, temperature uniformity 3°C |
壓力:**1-2萬KN，力均勻性<士1% Pressure: Maximum 1-20,000 KN, Force Uniformity<土1% | 真空度:≤10Pa Vacuum degree:≤10Pa |
壓頭:柔性壓頭/硬性壓頭 Indenter: Flexible indenter/rigid indenter |
