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產品概述/Product Introduction：

? 該設備是半導體生產線前工序的重要工藝設備之一，用于大規模集成電路、分立器件、電力電子、光電器件等行業的擴散、氧化、退火、合金和燒結等工藝

This equipment is one of the important process equipments in the front process of semiconductor production line, which is used for diffusion, oxidation, annealing, alloying and sintering in industries such as large-scale integrated circuits, discrete devices, power electronics, optoelectronic devices.

? 設計了硅片生產的多種工藝性能需要，具有生長效率高、產品性能優越的特點

The design takes into account various process performance requirements of silicon wafer production, and has the characteristics of high growth efficiency and superior product performance.

? 具有污染低、占地面積小、溫度均勻、可裝載晶圓尺寸大、工藝穩定性高等優點

It has the advantages oflow pollution, small occupied area, uniform temperature, large wafer size and high process stabili-

? 主要用于初始氧化層、屏蔽氧化層、襯墊氧化層、犧牲氧化層、場氧化層等多種氧化介質層的制備工藝

Mainly used in the preparation process of various oxidation dielectric layers such as initial oxide layer, shielding oxide layer, gasket oxide layer, sacrificial oxide layer and field oxide layer.