粉體行業在線展覽
面議
617
此設備在樣本和載玻片之間提供均勻的厚度。將樣品粘合到載玻片上是薄切片制備中的關鍵步驟。成功的切割,研磨和拋光很大程度上依賴于粘片質量,即**限度地減少膠層的厚度。首先,在載玻片和試樣上涂上一薄層環氧樹脂,然后將樣品精確黏貼,為了提高粘合效率,應將組件放置在加熱的粘合機上,使其在壓力和溫度下高質量的粘合。此設備可同時處理*多12個小尺寸樣品(26x46,27x47,28x48,30x45),6個大樣品(50x75)或6個小樣品和3個大樣品的組合。
溫度:可調節范圍20至130℃
重量:10公斤
尺寸:217x124x708毫米
電源:220VAC,50/60Hz
可調節加熱溫度
無彈簧設計,每個樣品可獨立設置壓力
同時處理12個樣本且保持恒溫(高達80℃)
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The bonding jig is designed to provide a uniform thickness of bonding material between specimens and glass sides. Bond the rock sample on its glass slide is a very important step in the thin section preparation. The success of grinding, lapping and polishing steps depends of the quality of bonding. The objective is to obtain very thin layers of glue. First, a thin layer of epoxy resin is applied on both the glass slide and the specimen. The glass slide is then manually stuck on the sample. To improve the bonding, the complete assembly is placed on the heating bonding press which allows to bond specimen and glass slide under pressure and temperature: The specimen is pressed on its glass slide thanks to an individual weight whereas the temperature is controlled from 20°C to 130°C +/- 2°C to ensure perfect bonding. Weight: Dimensions: Power supply: |
FORJ
德國MicroTec—CUT4055
PD-10電鏡粉末制樣儀
全自動切片機
YPZ-GZ110L
SPEED wave
ZYP-X60T
XHLQM-30
Spex 3636 X-Press? 實驗室用自動壓片機