粉體行業在線展覽
面議
673
LGP 250-P是專門為小規模拋光操作設計的設備。此設備堅固,簡單易用,以*小的投資同樣得到高質量的拋光表面。轉速可調節范圍10-600rpm。拋光過程需要配合拋光布或磁性拋光盤來使用。本設備提供帶有支架的拋光頭,同時拋光4個薄片。拋光頭的壓力可調節,單個樣品**可到施壓200克。設備共有兩套樣品支架,適用于30x45厘米(1x1.5英寸)的樣品。
重量:50公斤
尺寸:526×589×380毫米
電源:220VAC,50/60Hz
研磨盤直徑:250毫米
研磨盤轉速:10-600轉/分鐘
低速時也無振動
易于快速清潔
同時處理*多四個樣品
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The LGP 250-P is a single purpose apparatus specifically designed for small-scale polishing operations. The robust, simple to use system provides high quality polished chips and thin sections with the minimum capital investment. The disc speed can be varied from 10-600 rpm. Polishing is achieved by means of polishing cloths or magnetic polishing discs. A polishing head with four holders for the chip or thin section production is supplied. The former allows efficient, simultaneous polishing of up to 4 samples. Variable up to 200 gram weights apply a force to hold the sample’s position on the disc. Two sets of four specimen holders are supplied to suit either 30x45mm or 1 x 1.5 inch samples. Variable speed: Plate diameter: Dimensions: Weight: Power supply: |
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