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一． 產(chǎn)品介紹Product introduction

激光打標(biāo)機(jī)（laser marking machine）是用激光束在各種不同的物質(zhì)表面打上**的標(biāo)記，打標(biāo)的效應(yīng)是通過(guò)表層物質(zhì)的蒸發(fā)露出深層物質(zhì)，從而刻出精美的圖案、商標(biāo)和文字。從功能和波長(zhǎng)上來(lái)分有355nm的紫外激光打標(biāo)機(jī)、532nm的綠光激光打標(biāo)機(jī)和1064nm的紅外激光打標(biāo)機(jī)。它主要適用于五金工具、刀具廚具、塑料制品、食品、藥品生產(chǎn)日期、計(jì)算機(jī)鍵盤、金屬飾品、廣告標(biāo)牌鈕扣、集成電路、包裝瓶罐、眼鏡架、潔具龍頭、PCB/FPC切割分板、陶瓷材料打孔與劃片、玻璃/藍(lán)寶石/晶圓切割、LED襯底晶圓劃線等金屬和非金屬材料的切割和標(biāo)記。

Laser marking machine (Laser marking machine is a permanent marker on the surface of various substances by laser beam, the effect of marking is to expose deep substances through evaporation of surface substances, thus carving exquisite patterns, trademarks and characters. From the function and wavelength, it can be divided into 355 nm ultraviolet laser marking machine, 532 nm green laser marking machine and 1064 nm infrared laser marking machine). It is mainly suitable for cutting sapphire of metal and non-metal materials such as hardware tools, cutting tools, kitchenware, plastic products, food, drug production date, computer keyboard, metal ornaments, advertising signs, buttons, integrated circuits, packaging bottles and cans, spectacle frames, cleaning faucets, PCB FPC cutting sub-plates, perforation and scribing of ceramic materials, glass wafer cutting, led substrate wafer scribing, etc./// And markings.

二、技術(shù)參數(shù)technical parameter