粉體行業在線展覽
粉體行業在線展覽
Si-on-金剛石
直接聯系
北京青禾晶元半導體科技有限責任公司
北京
面議
青禾晶元
Si-on-金剛石
271
Si-on-金剛石
基于鍵合技術實現了金剛石基硅復合襯底，有望解決高功率密度硅器件散熱能力不足的難題
Based on the bonding technology, Si-on-diamond substrate has been realized, which is expected to solve the problem of insufficient heat dissipation of Si devices with high power density.
