粉體行業(yè)在線展覽
YCTC6060ZX系列陶瓷激光切割打孔劃線一體機(jī)
面議
宇昌激光
YCTC6060ZX系列陶瓷激光切割打孔劃線一體機(jī)
1702
一、產(chǎn)品介紹Product introduction:
※本機(jī)型采用國際先進(jìn)的特制光纖激光器,光束質(zhì)量好、體積小、光電轉(zhuǎn)換效率高。長期使用免維護(hù)、使用成本低、整機(jī)功耗小。
This model adopts international advanced special fiber laser, with good beam quality, small volume and high photoelectric conversion efficiency. Long term use, maintenance free, low cost and low power consumption of the whole machine
※采用進(jìn)口磁懸浮式直線電機(jī)、0.5um高精密光柵尺和全閉環(huán)總線系統(tǒng),具有加工速度快、精度高、維護(hù)率低等優(yōu)點。
The imported maglev linear motor, 0.5um high precision grating ruler and full closed loop bus system are adopted, which have the advantages of fast processing speed, high precision and low maintenance rate.
※ 主要用于氧化鋁、氧化鋯、氮化鋁、氮化硅等先進(jìn)陶瓷的激光切割和打孔。
It is mainly used for laser cutting and drilling of advanced ceramics such as alumina, zirconia, aluminum nitride and silicon nitride.
※配合CCD視覺定位系統(tǒng)還可以用于金屬化陶瓷、芯片基板的切割劃線等。
With CCD visual positioning system, it can also be used for cutting and marking of metallized ceramics and chip substrate
※也可用于各種精密的醫(yī)療器械、**產(chǎn)品、航空航天等產(chǎn)品的精細(xì)微孔加工,*小孔徑可達(dá)0.02-0.03mm。
It can also be used for fine micropore processing of various precision medical devices, military products, aerospace and other products, with a minimum pore diameter of 0.02-0.03mm
二、產(chǎn)品應(yīng)用行業(yè)Product application industry:
※工業(yè)產(chǎn)品:各種工業(yè)陶瓷襯板和模具
Industrial products: all kinds of industrial ceramic lining plates and molds。
※PCB行業(yè): 陶瓷電路板的切割打孔劃線。
PCB industry: cutting, punching and marking of ceramic circuit boards
※3C行業(yè):陶瓷基板、手機(jī)陶瓷背板、中框,電子煙發(fā)熱片、陶瓷指紋識別蓋板等.
3C industry: ceramic substrate, mobile phone ceramic back plate, middle frame, electronic smoke heating plate, ceramic fingerprint identification cover plate, etc
三、技術(shù)參數(shù)technical parameter:
序號 | 項目 | 參數(shù) |
1 | 激光器波長Laser wavelength | 1060-1080nm |
2 | 激光器功率Laser output power | 150W(功率可選) |
3 | 切割幅面Max.cutting range | 600*600mm |
4 | X/Y軸重復(fù)定位精度 Precision of repeated positioning of X/Y axis | ±5um |
5 | 加工速度 Processing speed | 0-500mm/s |
6 | **移動速度 Maximum distance speed | 80m/min |
7 | **加速度Maximum acceleration | 1G |
8 | 加工精度Cutting accuracy | ±0.01-0.02mm |
9 | 傳動方式Transmission mode | 進(jìn)口直線電機(jī)+0.5um光柵尺 |
10 | 整機(jī)功率(不含風(fēng)機(jī)) Whole machine power (no fan) | ≦7KW |
11 | 整機(jī)總重量 Total weight of the whole machine | 約1800KG |
12 | 外觀尺寸(長*寬*高)External dimension(length*width*height) | 1800*1470*1900mm (以實物為準(zhǔn)) |
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